- Filler for instant bonding and filling of cracks, gaps, holes and unevenness
- based on silicon oxide for bridging larger adhesive gaps of more than 0.1 mm
- Max. layer thickness per step 3 mm
- in combination with Contact Cyanoacrylate Adhesive not only for bonding, but also for reinforcing, shaping, modeling, fixing, filling as well as for leveling and leveling
- Density: 2.5 g/ml
- Container: Bottle
- Contents: 30 g
- Brand: WEICON
- Temperature resistance: +600 C

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